Sikadur® AP is used for general bonding and patching of a wide variety of materials such as:
Substrate Quality
Substrate Preparation
Requirements:
Pre-treatment for good bond:
Mixing
Please note that as a result of specific local regulations the performance of this product may vary from country to country. Please consult the local Product Data Sheet for the exact description of the application fields.
Store in original, unopened, sealed and undamaged packaging in dry conditions at temperatures between +5 °C and +30 °C. Protect from direct sunlight.
Weight | 0.25kg |
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Product Title | Sika Sikadur A.P All-purpose Epoxy Adhesive Paste |
Colour(s) | Part A: White , Part B: Light Brown, Mix: Beige |
Chemical Base | Epoxy Resin |
Density | 1.7kg/litre (mixed) |
Compressive Strength | 50.0Mpa at 16 hours (23ºC) |
Tensile Adhesion Strength | Concrete: 2-3N/mm² (concrete failure), Steel: 9N/mm² |
Mixing Ratio | 1:1 by volume: A component is to B component |
Ambient Air Temperature | Min. 5°C – Max. 35°C |
Relative Air Humidity | 80% |
Dew Point | Substrate temperature must always be at least 3°C above the dew point. |
Substrate Temperature | Min. 5°C – Max. 30°C. |